Solder Balls Market Report Research Report

Solder Balls Market by Product Type (Lead Solder Balls, Lead Free Solder Balls) Solder Type (Eutectic, Non-Eutectic) by End User(Automotive, Electronic) Industry Analysis, Volume, Share, Growth, Challenges, Trends, and Forecast

Number of pages: 165 | Report Code: PSMR- PSMR-00056 | Report Format : PDF

Report Coverage

Parameters Details

Base Year


Historical Data


Forecast Data


Base Year Value (2021)

USD 268.07 million

Forecast Value (2029)

USD 484.6067829 million

CAGR (2022 to 2029)

6.8 %

Regional Scope

North America, Europe, Asian Pacific, Latin America, Middle East and Africa, and ROW

A solder ball also known as a solder bump is a ball of solder that provides the contact between the chip package and the printed circuit board. It can also be used in stacked packages in multichip modules. The solder balls can be placed either with manually or by automated equipment, and are held in place with a tacky flux. In BGA package, solder ball is small sphere of solder that provides the contact between the BGA package and the printed circuit board. Solder ball could be damaged after fabrication of the BGA package; it could produce bad connections due to bad assembly. PCB which fails due to bad BGA connections can be repaired either by reflowing, or by removing the chip and cleaning it of solder, replacing old solder ball.  

Solder Balls Market is showing growth primarily because of growth of Automotive industry and Electronic industry. Automotive industry is growing at faster rate due to high demand of Automobile globally. While Electronic market in Asia Pacific region has shown tremendous growth due to large population and increase in disposable income. China , Japan , South Korea are the largest manufactures globally helping Solder Balls Market to grow with CAGR of 6.8%.  

Technological advanced Solder Balls production and use has emerged as driving factor in growth of Solder Balls Market. Use of Solder Balls in circuit and packaging increase contact reliability significantly this increases life time of device. High performance solder balls are increasing device performance significantly by providing high quality contact in circuit. Availability low toxic material for manufacturing created environmental issue for Solder Balls industry as manufactures are facing lot of problems from government. Leading manufactures are overcoming these environment issues with using lead free material and advanced technique to produce Eco friendly Solder Balls.  

Global  Solder Balls Market

Global Solder Balls Market : Product Type Analysis

  • Lead Solder Balls
  • Lead Free Solder Balls

Global Solder Balls Market : End User/ Applications Analysis

  • Automotive
  • Electronic

Global Solder Balls Market : Competitive Analysis

Report includes accurate analysis of key players with Market Value, Company profile, SWOT analysis. The Study constitutes of following key players

  • Duksan Metal
  • Hitachi Metals Nanotech
  • Nippon Micrometal
  • Indium Corporation
  • Senju Metal

Solder Balls Market: Regional Analysis

  • North America
    • U.S.A
  • Europe
    • Germany
    • France
    • Italy
    • Spain
    • UK
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
  • Latin America
    • Brazil
  • Middle East and Africa

Frequently Asked Questions (FAQ)

Solder Balls Market Report was valued at around USD 268.07 million in 2020 & estimated to reach USD 484.6067829 by 2028.

Solder Balls Market Report is likely to grow at compounded annual growth rate (CAGR) of 6.8% between 2021 to 2028.

segment dominated the global market in terms of revenue generation. region is likely to show the highest growth rate between 2021 to 2028.

Some of the top companies included in the research report are Duksan Metal, Hitachi Metals Nanotech, Nippon Micrometal, Indium Corporation, Senju Metal.

Solder Balls Market is showing growth primarily because of growth of Automotive industry and Electronic industry.

Yes, the report includes COVID 19 impact on the market.

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